After spin coating BARC and other chemical solutions, it can be baked at a maximum of 400°C! Automatic resist coating device with high-temperature baking capability.
The product is equipped with spin coating, HMDS treatment, high-temperature baking (MAX 400℃), low-temperature baking (MAX 200℃), and cooling functions.
Step baking is also possible with the combination of low-temperature and high-temperature baking.
High-temperature baking is possible after spin coating with chemicals other than resist!
Additionally, we have a proven track record with various chemicals including positive resist, negative resist, polyimide (PI), silicone, SOG, WAX, and many others!
We also have extensive experience in substrate transport for various materials such as silicon (Si), sapphire, ceramic, LT, GaAs, InP, GaN, SiC, and SiO2 (glass).
Rest assured with thin substrates like GaAs (thickness 150um), InP (thickness 150um), and LT (thickness 120um)!
【Features and Strengths】
■ Achieves affordable pricing
■ Automatic wafer size detection function
■ Equipped with automatic wafer detection function (mapping)
■ Compatible with wafer sizes from 2 to 12 inches
■ Supports low to high viscosity (1.7cP to 10000cP)
■ Proven track record with a variety of chemicals
■ Reduction of footprint (space-saving)
■ Numerous options available with resist reduction
*For more details, please refer to the PDF document or feel free to contact us.
